Double-sided circuit board , double-sided circuit board manufacturer

Double-sided tin plate / immersion gold plate production process:

Cutting material----drilling-----sinking copper----circuit---drawing electricity----etching-----soldering resistance---character----spraying tin ( Or immersion gold) - gong edge - v cutting (some boards do not need) ----- flying test - vacuum packaging

Double-sided gold-plated plate production process:

Cutting material----drilling-----sinking copper----circuit----diagram electric---gold plating----etching----solder mask----character--- --- gong edge --- v cutting --- flying test --- vacuum packing

Multilayer tin plate / immersion gold plate production process:

Cutting ------ inner layer ---- lamination ---- drilling --- copper sinking --- circuit --- drawing electricity --- etching ---- solder mask ---Character----Spraying tin (or immersion gold)-gong edge-v cutting (some boards do not need)-----flying test----vacuum packaging

Multi -layer board gold-plated board production process:

Material cutting------inner layer------lamination---drilling---copper sinking---circuit---patterning---gold plating---etching--- --Solder Mask---Character---Gong Edge---V Cut---Flying Test---Vacuum Packing